Michele H. Miller

(Reading, Writing, Speaking)

National Science Foundation (NSF): Hands-On Ability: Why It Matters and How to Improve It, $396,109, 2009 to 2010.
National Science Foundation (NSF): Weaving Threads of Sustainability into the Fabric of the Mechanical Engineering Curriculum: Impacting the Fundamental Manner in which Students Solve Problems, $144,604, 2009 to 2011.
State of Michigan: Optimizing Chemo-Mechanical Structure for MEMS Chemical Vapor Sensor Arrays, $808,832, 2007 to 2010.
Boston University/DARPA: Investigation of Electrostatic Micromirror Dynamics, $15,000, 2004 to 2004.
National Science Foundation (NSF): Undergraduate Exploration of Nano-Science, Applications, and Societal Implications at Michigan Tech, 100,000, 2003 to 2005.
Chand Kare Technical Ceramics: Enhancement of Ceramic Grindability Test System, 15,000, 2002 to 2003.
National Science Foundation (NSF): Hybrid Processes for Machining Brittle Materials, $235,000, 1999 to 2004.

• Miller, M. H., Perrault, J. A., Parker, G. G., Bettig, B. P., Bifano, T. G. (2006) Simple models for piston type micromirror behavior, J. Micromechanics and Microengineering, 16 (2), 303-313
• X. Fan, M. H. Miller (2006) Force Analysis for Grinding with Segmental Wheels, Machining Science and Technology, 10, 435-455
• Lee, H., M. H. Miller and T. G. Bifano, CMOS Chip Planarization by Chemical Mechanical Polishing for a Vertically Stacked Metal MEMS Integration, J Micromechanics and Microengineering, 14(1), 108-115, 2004
• Salisbury, E. J., K. V. Domala, K. S. Moon, M. H. Miller and J. W. Sutherland, A Three Dimensional Model for the Surface Texture in Surface Grinding, Part 2—Grinding Wheel Model, Journal of Manufacturing Science and Engineering, 123(4), 582-590, 2004
• Lee, H., Miller, M. H., Bifano, T. G. (2004) CMOS Chip Planarization by Chemical Mechanical Polishing for a Vertically Stacked Metal MEMS Integration, J. Micromechanics and Microengineering, 14 (1), 108-115
• Salisbury, E. J., K. V. Domala, K. S. Moon, M. H. Miller and J. W. Sutherland, A Three Dimensional Model for the Surface Texture in Surface Grinding, Part 1—Surface Generation Model, Journal of Manufacturing Science and Engineering, 123(4), 576-581, 2001
• Salisbury, E. J., Domala, K. V., Moon, K. S., Miller, M. H., Sutherland, J. W. (2001) A Three Dimensional Model for the Surface Texture in Surface Grinding, Part 1--Surface Generation Model, J. Mfg Sci. and Engineering, 123 (4), 576-581
• Qu, W., K. Wang, M. H. Miller, Y. Huang and A. Chandra,, Using Vibration Assisted Grinding to Reduce Subsurface Damage,” Precision Engineering, Precision Engineering, 24(4), 329-337, 2000
• Chandra, A., K. Wang, Y. Huang, G. Subhash, M. H. Miller and W. Qu, Role of Unloading in Machining of Brittle Materials, Journal of Manufacturing Science and Engineering, 122(3), 452-462, 2000
• Sharp, K. W., M. H. Miller and R. O. Scattergood, Analysis of the Grain Depth-of-Cut in Plunge Grinding, Precision Engineering, 24(3), 220-230, 2000
• Miller, M. H. and T. A. Dow, Influence of the Grinding Wheel in the Ductile Grinding of Brittle Materials: Development and Verification of Kinematic Based Model, Journal of Manufacturing Science and Engineering, 121(4), 638-646, 1999
• Wang, Y., K. S. Moon and M. H. Miller, A New Method for Improving the Surface Grinding Process, International Journal for Manufacturing Science and Production, 1(3), 159-167, 1998
• Miller, M. H. and T. A. Dow, Wheel Speed Equilibria in Precision Contour Grinding, Precision Engineering, 19(2/3), 148-156, 1996
• Miller, M. H., K. P. Garrard, T. A. Dow and L. W. Taylor, A Controller Architecture for Integrating a Fast Tool Servo into a Diamond Turning Machine, Precision Engineering, 16(1), 42-48, 1994
• Dow, T. A., M. H. Miller and P. J., Application of a Fast Tool Servo for Diamond Turning of Nonrotationally Symmetric Surfaces, Precision Engineering, 13(4), 243-250, 1991